I work for a Hsinchu, Taiwan based IC packaging factory, established in 1995. We package flash wafer ink die, manufacture SD cards, and USB drives. Our latest development is a 12mHz quartz resonator, SMD packaged, 5032 size spec. In the past we have packaged SDRAM, DRAM, and subsequently produced DDR, DDRII modules. We hold world wide patents for our COB packaging of mini-SD and micro-SD cards, as well as COB style USB (3 years ago).
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